Rigid-Flex PCB Capabilities

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Rigid-Flex PCB Capabilities

Material

Sub-Categories Standard Advanced
FCCL (Adhesive) Shengyi SF305:Pl=0.5mil, 1mil, and 2mil; Cu=0.33oz, 0.5oz, and 1oz /
FCCL (Adhesiveless) Panasonic R-F775: Pl=1mil and 2mil; Cu=0.33oz, 0.5oz, and 1oz Pl=1mil, 2mil; Cu=2oz
DuPont Pyralux AP: Pl=1mil, 2mil, and 3mil; Cu=0.33oz, 0.5oz, and 1oz Pl=1mil, 2mil, 3mil, and 4mil; Cu=2oz
Coverlay Shengyi SF305C; 0515, 1025, and 2030 /
Taiflex FHK: 0515, 1025, and 2035 /
Adhesive Taiflex BT: AD=10um, 25um, and 40um /
Pl Stiffener Taiflex MHK: Pl=3mil, 5mil, 7mil, and 9mil /
3M 9460, 9077, 9458, 468 /
NO FLOW PP Ventec:VT-47N. EMC:EM-37B(L) Ventec:VT-901
CCL ITEQ: IT-180A; Shengyi: S1000-2 /
Other CCL Arlon: 85N; Rogers: RO4000 series; Nelco: N4000-13 series Ventec:VT-901

Others

Sub-Categories Standard Advanced
Design Software CAM350, PROTEL, PADS, POWERPCB, AUTOCAD, GENESIS, ORCAD /
Gerber Format RS-274-D, RS-274-X /
Drill Format EXCELLON format /
Layer 2-10 11-20
Board Thickness 0.2mm-3.0mm 3.0mm-4.0mm
Tolerance of Board Thickness (Thickness>1.0mm) ±10% /
Tolerance of Board Thickness (Thickness≤1.0mm) ±0.1mm /
Min Board Size 10mm*15mm /
Max Board Size 400mm*550mm 400mm*730mm
Impedance Control Tolerance Single-ended: ±5Ω(≤50Ω),±10%(50Ω) Single-ended: ±4Ω(≤50Ω),±8%(>50Ω)
Differential:±5Ω(≤50Ω),±10%(>50Ω) Differential:±4Ω(≤50Ω),±8%(>50Ω)
HDI / 1+n+1(buried via≤0.4mm)
Min Bow & Twist 0.75%(symmetrical), 2%(unsymmetrical) 1.5%(unsymmetrical)

Inner Layer

Sub-Categories Standard Advanced Notes
Min Line Width/Spacing (12,18um Copper) 3.5/3.5mil (3.2/3.2mil) 3/3mil (2.8/2.8mil) ()=partly
Min Line Width/Spacing (35um Copper) 4/4mil (3.5/3.5mil) 3.5/3.5mil (3/3mil) ()=partly
Min Line Width/Spacing (70um Copper) 6/7mil (5.5/6.5mil) 5/6mil (4.5/5.5mil) ()=partly
Annular Ring (Blind Via) 4mil 3mil
Max Copper Thickness 2oz 3oz

Outer Layer

Sub-Categories Standard Advanced Notes
Min Line Width/Spacing (18um Copper) 4/4mil (3.5/3.5mil) 3.5/3.5mil (3/3mil) ()=partly
Min Line Width/Spacing (35um Copper) 4.5/4.5mil (4/4mil) 4/4mil (3.5/3.5mil) ()=partly
Min Line Width/Spacing (70um Copper) 6/9mil (5.5/8.5mil) 5.5/8.5mil (5/8mil) ()=partly
Min Line Width/Spacing (105um Copper) 10/13mil (9.5/12.5mil) 9.5/12.5mil (9/12mil) ()=partly
Min Line Width/Spacing (18um Copper, Flex on the Surface of Board) 5/5mil (4.5/4.5mil) 4.5/4.5mil (4/4mil) ()=partly
Min Line Width/Spacing (35um Copper, Flex on the Surface of Board) 5.5/6mil (5/5.5mil) 5/5.5mil (4.5/5mil) ()=partly
Min Line Width/Spacing (70um Copper, Flex on the Surface of Board) 7.0/10mil (6.5/9.5mil) 6.5/9.5mil (6/9mil) ()=partly
Min BGA Pad Size 12mil (8mil for electrical soft gold board) 10mil (7mil for electrical soft gold board)
Max Finished Copper Thickness 3oz 5oz

Drilling

Sub-Categories Standard Advanced Notes
Blind Via / 4mil-6mil (6mil preferable)
Max Buried Via 0.4mm /
Aspect Ratio (Mechanical Drill) 10:1 12:1
Aspect Ratio (Laser Drill) / 0.8:1
Min Distance Between Via and Conductors 6mil (≤6 layer) 5mil (≤6 layer)
8mil(7~11 layer) 6mil(7~11 layer)
12mil(≥12 layer) 10mil(≥12 layer)
Min Distance Between Blind Via and Conductors / 6mil 1 Step HDI
Tolerance of Non-Plated Holes ±2mil(limited is +0/-2mil or 2mil/-0) /

Solder Mask and Silk Screen

Sub-Categories Standard Advanced Notes
Solder Mask Color Green, Black, Blue, Red, Matte Green, White /
Min Solder Dam (Copper≤1oz) 4mil (Green, Red, and Blue), 5mil (Black and White) /
Min Solder Damn (Copper 2-4oz) 8mil 6mil
Min Clearance 2.5mil (2.0mil) 2.0mil (1.5mil) ()=partly
Diameter of Plugged Hole / 0.2-0.5mm
Aspect Ratio (Hole Plugged with Non-Conductive Resin) / 10:1
Silk Color White, Yellow, Black /

Surface Treatment

Sub-Categories Standard Advanced
Surface Treatment HASL/LF, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Immersion Silver, Immersion Tin and OSP /
Mixed Surface Treatment ENIG+OSP, ENIG+Gold Finger, Electrical Gold+Gold Fingers /
Gold Thickness (ENIG) 0.05-0.10um /
Nickel Thickness (ENIG) 3-8um /
Gold Thickness (ENEPIG) 0.05-0.10um /
Palladium Thickness (ENEPIG) 0.05-0.15um /
Nickel Thickness (ENEPIG) 3-8um /
Hard Gold Thickness (Leadless) 0.1-1.5um /
Hard Gold Thickness (Including Lead) 0.1-4.0um /
Electrolytic Nickel Thickness ≥3um /
Electrolytic Gold Thickness 0.05-0.10um /
Immersion Silver Thickness 0.2-0.4um /
OSP Thickness 0.1-0.3um /

Routing

Sub-Categories Standard Advanced
Tolerance of Board Outline ±4mil(exclude complicated board outline and cutout) /

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Thank you for reviewing our PCB capabilities. You can submit your Gerber file and request for a quote by clicking the button below. You can also reach out directly to your sales representative. We look forwards to supporting you and all of your PCB needs.
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Upload Your Gerber File

Thank you for reviewing our PCB capabilities.  You can submit your Gerber file and request for a quote here! You can also reach out directly to your sales representative.

We look forward to supporting you and all of your PCB needs.