| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Normal FR4 | Shengyi S1141 (Not recommended for lead-free assembly process) | Shengyi S1141 (Not recommended for No-Pb assembly process) |
| Normal Tg FR4 (Halogen Free) | Shengyi S1155 | Shengyi S1165 |
| High Tg FR4 (Halogen Free) | Shengyi S1165 | Shengyi S1165 |
| HDI PCB Material | LDPP(IT-180A 1037&1086), Normal PP 106&1080 | LDPP(IT-180A 1037&1086), Normal PP 106&1080 |
| High CTI | Shengyi S1600 | Shengyi S1600 |
| High Tg FR4 | FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR;IT180A, IT-150DA;N4000-13, N4000-13EP, N4000-13SI, N4000-13EP;Megtron 4, Megtron 6(Panasonic);EM-827(Elite);GA-170(Grace Electron);NP-180(nanya);TU-752, TU-662(Taiwan Union);MCL-BE-67G(H), MCL-E-679(W), MCL-E-679(J)(Hitachi);VT-47(Ventec) | IT180A, GETEK, PCL-370HR, N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI |
| Ceramic Particle Filled Laminates | Rogers4350, Rogers4003, 25FR, 25N | Rogers4350, Rogers4003, 25FR, 25N |
| PTFE Laminates | Rogers series, Taconic series, Arlon series, Nelco series, Taizhou Wangling F4BK series, TP series | Taconic (TLX, TLF, TLY, RF, TLC, TLG series);Arlon(Diclad, AD series) |
| PTFE PP | Taconic TP series, TPG series, TPN series, HT1.5(1.5mil), fastride series | / |
| Hybrid Laminating | Rogers/Taconic/Arlon/Nelco laminate with FR-4 material (including partial Ro4350B hybrid laminating with FR-4) | Rogers/Taconic/Arlon/Nelco laminate with FR-4 material (including partial Ro4350B hybrid laminating with FR-4) |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Rigid PCB | Backplane, HDI, High multi-layer blind&buried PCB, Embedded Capacitance, Embedded resistance board, Heavy copper power PCB, Backdrill, Semiconductor Test products. | Backplane, HDI, High multi-layer blind&buried PCB, Backdrill |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Blind & Buried Via Type | Mechanical blind & buried vias with less than 3 times laminating | Backplane, HDI, High multi-layer blind&buried PCB, Backdrill |
| HDI PCB | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3(n buried vias≤0.3mm), Laser blind via can be filling plating | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3(n buried vias≤0.3mm), Laser blind via can be filling plating |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Lead Free | Flash gold(electroplated gold), ENIG, Hard gold, Flash gold, HASL Lead free, OSP, ENEPIG, Soft gold, Immersion silver, Immersion Tin, ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger | Flash gold(electroplated gold), ENIG, Hard gold, Flash gold, HASL Lead free, OSP, ENEPIG, Soft gold, Immersion silver, Immersion Tin, ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger |
| Leaded | Leaded HASL | Leaded HASL |
| Aspect Ratio | 10:1(HASL Lead free, HASL Lead, ENIG, Immersion Tin, Immersion silver, ENEPIG); 8:1(OSP) | 10:1(HASL Lead free, HASL Lead, ENIG, Immersion Tin, Immersion silver, ENEPIG); 8:1(OSP) |
| Max Finished Size | HASL Lead 5"*6"; HASL Lead free 10"*10"; Flash gold 12"*16"; Hard gold 3"*3"; Flash gold(electroplated gold) 8"*10"; Immersion Tin 2"*4"; Immersion silver 2"*4"; OSP 2"*2"; | HASL Lead 22"*39"; HASL Lead free 22"*24"; Flash gold 24"*24"; Hard gold 24"*28"; ENIG 21"*27"; Flash gold(electroplated gold) 21"*48"; Immersion Tin 16"*21"; Immersion silver 16"*18"; OSP 24"*40"; |
| Min Finished Size | HASL Lead 5"*6"; HASL Lead free 10"*10"; Flash gold 12"*16"; Hard gold 3"*3"; Flash gold(electroplated gold) 8"*10"; Immersion Tin 2"*4"; Immersion silver 2"*4"; OSP 2"*2"; | HASL Lead 5"*6"; HASL Lead free 10"*10"; Flash gold 12"*16"; Hard gold 3"*3"; Flash gold(electroplated gold) 8"*10"; Immersion Tin 2"*4"; Immersion silver 2"*4"; OSP 2"*2"; |
| PCB Thickness | HASL Lead 0.6-4.0mm; HASL Lead free 0.6-4.0mm; Flash gold 1.0-3.2mm; Hard gold 0.1-5.0mm; ENIG 0.2-7.0mm; Flash gold(electroplated gold) 0.15-5.0mm; Immersion Tin 0.4-5.0mm; Immersion silver 0.4-5.0mm; OSP 0.2-6.0mm; | HASL Lead 0.6-4.0mm; HASL Lead free 0.6-4.0mm; Flash gold 1.0-3.2mm; Hard gold 0.1-5.0mm; ENIG 0.2-7.0mm; Flash gold(electroplated gold) 0.15-5.0mm; Immersion Tin 0.4-5.0mm; Immersion silver 0.4-5.0mm; OSP 0.2-6.0mm; |
| Max High to Gold Finger | 1.5 inch | 1.5 inch |
| Min Space Between Gold Fingers | 6 mil | 8 mil |
| Min Block Space to Gold Fingers | 7.5 mil | 7.5 mil |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Tin Thickness | 2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free) | 2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free) |
| OSP | 0.2-0.6μm | 0.2-0.6μm |
| ENIG | Ni: 3-8μm; Au: 0.05-0.1μm | Ni: 3-8μm; Au: 0.05-0.1μm |
| Immersion Silver | 0.2-0.4μm | 0.2-0.4μm |
| Immersion Tin | ≥1.0 | ≥1.0 |
| Hard Gold | 0.1-4.0μm | 0.1-2.0μm |
| Soft Gold | 0.1-4.0μm | 0.1-4.0μm |
| ENEPIG | Ni: 3-8μm, Pd: 0.05-0.15μm, Au: 0.05-0.1μm | Ni: 3-8μm, Pd: 0.05-0.15μm, Au: 0.05-0.1μm |
| Flash Gold(Electroplated Gold) | Ni:≥3μm ; Au: 0.025-0.1μm ; base copper≤1 oz | Ni:≥3μm ; Au: 0.025-0.1μm ; base copper≤1 oz |
| Electroplated Gold Finger | Ni:≥3μm ; Au: 0.25-0.1.5μm(The Thinnest Point) | Ni:≥3μm ; Au: 0.25-0.1.5μm(The Thinnest Point) |
| Carbon | 10-50μm | 10-50μm |
| Soldermask | 0.4-0.7mil (on copper area), 0.2-0.31mil(on via pad), ≥0.2mil(on circuits around the corner, just for one-time print and copper thickness<48μm) | 0.4-0.7mil (on copper area), 0.2-0.31mil(on via pad), ≥0.2mil(on circuits around the corner, just for one-time print and copper thickness<48μm) |
| Blue Plastic | 8--31.5mil | 8--16mil |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| MAX Thickness of Mechanical Hole 4mil/6mil/8mil | 31.5mil/59mil/100mil | 24mil/47mil/63mil |
| Min Laser Drilling Size | 4mil | 4mil |
| Max Laser Drilling Size | 6mil | 6mil |
| Finished Mechanical Hole Size | 4-244mil(corresponding drilling tool size 6-248mil) | 5-244mil(corresponding drilling tool size 8-248mil) |
| A. Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil) | A. Min finished hole size for PTFE material and hybrid PCB is 12mil(corresponding drilling tool size 16mil) | |
| B. Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil) | B. Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil) | |
| C. Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil) | C. Max finished hole size for via-in-pad pluged with solder mask is 12mil(corresponding drilling tool size 16mil) | |
| D. Min connecting hole size is 14mil(corresponding drilling tool size is 18mil) | D. Min connecting hole size is 14mil(corresponding drilling tool size is 18mil) | |
| E. Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil) | E. Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil) | |
| MAX Aspect Ratio for Hole Plate | 20:1 (hole diameter>8mil) | 10:1 |
| Max Aspect Ratio for Laser Via Filling Plating | 1:1(Depth included copper thickness) | 0.9:1(Depth included copper thickness) |
| Max Aspect Ratio for Mechanical Depth-Control Drilling Board(Blind Hole Drilling Depth/Blind Hole Size) | 1.3:1(drilling tool size≤8mil), 1.15:1(drilling tool size≥10mil) | 0.8:1(drilling tool size≥10mil)) |
| Min Depth of Mechanical Depth-Control(Backdrill) | 8mil | 8mil |
| Min Gap Between Hole Wall and Conductor (None Blind and Buried Via PCB) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | 7mil(≤8L),9mil(10-14L),10mil(>14L) |
| Min Gap Between Hole Wall Conductor (Blind and Buried Via PCB) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | 8mil(1 time laminating), 10mil(2 times laminating), 12mil(3 times laminating) |
| Min Gap Between Hole Wall Conductor (Laser Blind Hole Buried Via PCB) | 7mil (1+N+1) ; 8mil (1+1+N+1+1 or 2+N+2) | 7mil (1+N+1) ; 8mil (1+1+N+1+1 or 2+N+2) |
| Min Space Between Laser Holes and Conductor | 5mil | 6mil |
| Min Space Between Hole walls in Different Net | 10mil | 10mil |
| Min Space Between Hole Walls in Same Net | 6mil(thru-hole & laser hole PCB), 10mil(Mechanical blind & buried PCB) | 6mil(thru-hole & laser hole PCB), 10mil(Mechanical blind & buried PCB) |
| Min Space Between NPTH Hole Walls | 8mil | 8mil |
| Hole Location Tolerance | ±2mil | ±2mil |
| NPTH Tolerance | ±2mil | ±2mil |
| Pressfit Holes Tolerance | ±2mil | ±2mil |
| Countersink Depth Tolerance | ±6mil | ±6mil |
| Countersink Hole Size Tolerance | ±6mil | ±6mil |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Min Pad Size for Laser Drillings | 10mil(for 4mil laser via), 11mil(for 5mil laser via) | 10mil(for 4mil laser via), 11mil(for 5mil laser via) |
| Min Pad Size for Mechanical Drillings | 16mil(8mil drillings) | 16mil(8mil drillings) |
| Min BGA Pad Size | HASL:10mil, LF HASL:12mil, other surface technics are 7mil | HASL:10mil, LF HASL:12mil, other surface technics are 10mil (7mil is ok for flash gold) |
| Pad Size Tolerance (BGA) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Internal Layer | 1/2OZ: 3/3mil | 1/2OZ: 3/3mil |
| 1OZ: 3/4mil | 1OZ: 3/4mil | |
| 2OZ: 4/5mil | 2OZ: 4/5.5mil | |
| 3OZ: 5/8mil | 3OZ: 5/8mil | |
| 4OZ: 6/11mil | 4OZ: 6/11mil | |
| 5OZ: 7/13.5mil | 5OZ: 7/14mil | |
| 6OZ: 8/15mil | 6OZ: 8/16mil | |
| 7OZ: 9/18mil | 7OZ: 9/19mil | |
| 8OZ: 10/21mil | 8OZ: 10/22 mil | |
| 9OZ: 11/24mil | 9OZ: 11/25mil | |
| 10OZ: 12/27mil | 10OZ: 12/28mil | |
| External Layer | 1/3OZ: 3/3mil) | 1/3OZ: 3.5/4mil |
| 1/2OZ: 3.5/3.5mil | 1/2OZ: 3.9/4.5mil | |
| 1OZ: 4.5/5mil | 1OZ: 4.8/5.5mil | |
| 1.43OZ (positive) :4.5/6 | 1.43OZ (positive) :4.5/7 | |
| 1.43OZ (negative) :5/7 | 1.43OZ (negative) :5/8 | |
| 2OZ: 6/7mil | 2OZ: 6/8mil | |
| 3OZ: 6/10mil | 3OZ: 6/12mil | |
| 4OZ: 7.5/13mil | 4OZ: 7.5/15mil | |
| 5OZ: 9/16mil | 5OZ: 9/18mil | |
| 6OZ: 10/19mil | 6OZ: 10/21mil | |
| 7OZ: 11/22mil | 7OZ: 11/25mil | |
| 8OZ: 12/26mil | 8OZ: 12/29mil | |
| 9OZ: 13/30mil | 9OZ: 13/33mil | |
| 10OZ: 14/35mil | 10OZ: 14/38mil | |
| Width Tolerance | ≤10mil: +/-1.0mil | ≤10mil: +/-20% |
| >10mil: +/-1.5mil | >10mil: +/-20% |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| MAX drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil |
| Soldermask Color | Green matte/glossy, Yellow, Black, Blue, Red, white, Purple | Green matte/glossy, Yellow, Black, Blue, Red, white, Purple |
| Silkscreen Color | White, Yellow, Black | White, Yellow, Black |
| MAX Hole Size for Via Filled with Blue Glue Aluminium | 197mil | 197mil |
| Finish Hole Size for Via Filled with Resin | 4-25.4mil | 4-25.4mil |
| Max Aspect Ratio for Via Filled with Resin Board | 12:1 | 12:1 |
| Min Width of Soldermask Bridge | Base Copper≤0.5 oz, Immersion Tin: 7.5mil(Black), 5.5mil(Other color), 8mil(On copper area) | Base Copper≤0.5 oz, Immersion Tin: 7.5mil(Black), 5.5mil(Other color), 8mil(On copper area) |
| Base Copper≤0.5 oz, Finish treatment not Immersion Tin: 5.5mil(Black, extremity 5mil), 4mil(Other color, extremity 3.5mil), 8mil(On copper area) | Base Copper≤0.5 oz, Finish treatment not Immersion Tin: 5.5mil(Black, extremity 5mil), 4mil(Other color, extremity 3.5mil), 8mil(On copper area) | |
| Base Copper 1 oz: 4mil(Green), 5mil(Other Color), 5.5mil(Black, extremity 5 mil), 8mil(On copper area) | Base Copper 1 oz: 4mil(Green), 5mil(Other Color), 5.5mil(Black, extremity 5 mil), 8mil(On copper area) | |
| Base Copper 1.43 oz: 4mil(Green), 5.5mil(Other color), 6mil(Black), 8mil(On copper area) | Base Copper 1.43 oz: 4mil(Green), 5.5mil(Other color), 6mil(Black), 8mil(On copper area) | |
| Base Copper 2 oz-4 oz: 6mil, 8mil(On copper area) | Base Copper 2 oz-4 oz: 6mil, 8mil(On copper area) |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Min Space of the V-CUT does not Reveal the Copper (Central Line of V-Cut to Internal/External Circuits, H Means Board thickness) | H≤40mil: 12mil(20° mean V-CUT angle), 13mil(30°), 14.6mil(45°) | H≤40mil: 12mil(20° mean V-CUT angle), 13mil(30°), 14.6mil(45°) |
| 40<H≤63mil: 14.2mil(20°), 16mil(30°), 20mil(45°) | 40<H≤63mil: 14.2mil(20°), 16mil(30°), 20mil(45°) | |
| 63<H≤94.5mil: 16.5mil(20°), 20mil(30°), 25.2mil(45°) | 63<H≤94.5mil: 16.5mil(20°), 20mil(30°), 25.2mil(45°) | |
| 94.5<H≤118.1mil: 18.5mil(20°), 23.2mil(30°), 30.3mil(45°) | 94.5<H≤118.1mil: 18.5mil(20°), 23.2mil(30°), 30.3mil(45°) | |
| V-CUT Symmetrical Tolerance | ±4mil | ±4mil |
| MAX V-CUT Lines | 100 | 100 |
| V-CUT Angle Tolerance | ±5° | ±5° |
| V-CUT Angle | 20, 30, 45° | 20, 30, 45° |
| Gold Finger Bevelling | 20, 30, 45, 60° | 20, 30, 45, 60° |
| Gold Finger Bevelling Tolerance | ±5° | ±5° |
| Min Space of Gold Finger Chamfering Noninterference Tab | 236mil | 275.6mil |
| Min Gap Between the Side of Gold Finger and the Shape edge Line | 8mil | 10mil |
| Depth Tolerance of Depth-Control Groove Milling | ±4mil | ±4mil |
| Routing Tolerance (Edge to Edge) | ±4mil | ±4mil |
| Min Tolerance for Routing Slot (PTH) | width/length tolerance ±5mil | width/length tolerance ±5mil |
| Min Tolerance for Routing Slot (NPTH) | width/length tolerance ±4mil | width/length tolerance ±4mil |
| Min Tolerance for Drilling Slot (PTH) | width tolerance ±3mil; Length/width≥2, length tolerance ±3mil; Length/width<2, length tolerance ±4mil | width tolerance ±3mil; Length/width≥2, length tolerance ±3mil; Length/width<2, length tolerance ±4mil |
| Min Tolerance for Drilling Slot (NPTH) | width tolerance ±2mil; Length/width≥2, length tolerance ±2mil; Length/width<2, length tolerance ±3mil | width tolerance ±2mil; Length/width≥2, length tolerance ±2mil; Length/width<2, length tolerance ±3mil |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Min Gap Between Mechanical Hole Wall and Conductor (Local Mixed Pressure Area) | 12mil (local 10 mil) | 12mil (local 10 mil) |
| Min Gap Between Mechanical Hole Wall and the Junction of Local Mixed Pressure | 10mil | 10mil |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Layer Counts | 1-8L(A1-substrate, Cu-substrate); 2-24L(Heatsink, Sweat bonding, Buried meta;); 1-2L(Ceramic-substrate) | 1-8L(A1-substrate, Cu-substrate); 2-24L(Heatsink, Sweat bonding, Buried meta;); 1-2L(Ceramic-substrate) |
| PCB Size (Finished) | Max: 24"*24", Min: 0.2"*0.2" (A1-substrate, Cu-substrate, Heatsink, Sweat bonding, Buried metal) | Max: 24"*24", Min: 0.2"*0.2" (A1-substrate, Cu-substrate, Heatsink, Sweat bonding, Buried metal) |
| MAX PCB Size (Ceramic-Substrate PCB) | 4"*4" | 4"*4" |
| PCB Thickness (Finished) | 0.02"-0.2" | 0.02"-0.2" |
| Copper thickness (Finished) | 0.5-10 oz | 0.5-10 oz |
| Metal Thickness | 0.02"-0.2" | 0.02"-0.2" |
| Metal Material Type | AL:1100/1050/2124/5052/6061; Cu:c11000; Iron | AL:1100/1050/2124/5052/6061; Cu:c11000; Iron |
| Min Finished Hole Size and Tolerance | NPTH:20±2mil; PTH:40±4mil(for A1-substrate, Cu-substrate), 8±4mil(for Heatsink, Sweat bonding, Buried metal) | NPTH:20±2mil; PTH:40±4mil(for A1-substrate, Cu-substrate), 8±4mil(for Heatsink, Sweat bonding, Buried metal) |
| Dimension Tolerance | ±1.2mil | ±2mil |
| PCB Partial Surface Treatment | Leaded HASL/Lead free HASL; OSP; ENIG; ENEPIG; Plating(Ni)Soft/Hard gold; Plating Sn | Leaded HASL/Lead free HASL; OSP; ENIG; ENEPIG; Plating(Ni)Soft/Hard gold; Plating Sn |
| Metal Partial Surface Treatment | Cu:Plating Ni&Au; A1:Anodic oxidation, Hard anodic oxidation coating, Chemical passivation; Physical treatment:Sandblasting, Wire drawing | Cu:Plating Ni&Au; A1:Anodic oxidation, Hard anodic oxidation coating, Chemical passivation; Physical treatment:Sandblasting, Wire drawing |
| Material | Metal PCB:Totking(T-110, T-111), Ventec(VT-4A1, VT-4A2, VT-4A3), Laird(1KA04), 1KA06;Berquist(MP06503, HT04503), TACONIC(TLY-5, TLY-5F) | Metal PCB:Totking(T-110, T-111), Ventec(VT-4A1, VT-4A2, VT-4A3), Laird(1KA04), 1KA06;Berquist(MP06503, HT04503), TACONIC(TLY-5, TLY-5F) |
| Thermal Glue Thickness (Dielectric Layer) | 3-6mil | 3-6mil |
| Buried Copper Block Size | 0.118"*0.118" -- 2.756"*3.15" | 0.118"*0.118" -- 2.756"*3.15" |
| Buried Copper Block Drop Tolerance | ±1.6mil | ±1.6mil |
| Min Gap Between Buried Copper Block and Hole Wall | 12mil | 12mil |
| Thermal Conductivity | 0.3-3w/m.k(Heatsink, A1-substrate, Cu-substrate); 8.33w/m.k(Sweat bonding); 0.35-3w/m.k(Buried metal); 24-180w/m.k(Ceramic-substrate) | 0.3-3w/m.k(Heatsink, A1-substrate, Cu-substrate); 8.33w/m.k(Sweat bonding); 0.35-3w/m.k(Buried metal); 24-180w/m.k(Ceramic-substrate) |
| Sub-Categories | Prototype Capabilities | Production Capabilities |
|---|---|---|
| Max Finished Copper Thickness to Internal and External Layer | Internal layer: 10 oz; External layer: 11 oz | Internal layer: 4 oz; External layer: 5 oz |
| Finished Copper Thickness to External Layer | Base copper 1/3 oz, 0.5 oz ≥35.8μm (reference value: 35.8-42.5μm); ≥40.4μm (reference value: 40.4-48.5μm) | Base copper 1/3 oz, 0.5 oz ≥35.8μm (reference value: 35.8-42.5μm); ≥40.4μm (reference value: 40.4-48.5μm) |
| Base copper 1 oz, 1.43 oz, 2 oz: ≥55.9μm; ≥70μm; ≥86.7μm | Base copper 1 oz, 1.43 oz, 2 oz: ≥55.9μm; ≥70μm; ≥86.7μm | |
| Base copper 3 oz, 4 oz: ≥117.6μm; ≥148.5μm | Base copper 3 oz, 4 oz: ≥117.6μm; ≥148.5μm | |
| Layer Count | 1-50L | 1-20L |
| PCB Thickness | 8-275.6mil(No Soldermask); 15.7-275.6mil(Have Soldermask) | 11.8-196.85mil(No Soldermask); 15.7-196.85mil(Have Soldermask) |
| PCB Thickness Tolerance (Normal) | Thickness>40mil: ±10%; Thickness≤40mil: ±4mil | Thickness>40mil: ±10%; Thickness≤40mil: ±4mil |
| PCB Thickness Tolerance (Special) | Thickness≤80mil: ±4mil; 80mil<Thickness≤120mil: ±6mil | Thickness≤80mil: ±10%; 80mil<Thickness≤120mil: ±6mil |
| Min Finished PCB Size | 0.4"*0.4" | 2.0"*4.0" |
| Max Finished PCB Size | 23*35 inch(2L); 22.5*33.5 inch(4L); 22.5*30 inch (≥6L) | 20*30 inch(2L); 22.5*30 inch(4L); 16.5*22.5 inch (≥6L) |
| Ionic Soil | ≤1ug/cm² | ≤1ug/cm² |
| Min Bow & Twist | 0.1% (This ability requires same laminated plate type, symmetrical laminated construction, the difference of symmetry layer copper area within 10%, uniform wiring, excluding the large area of copper and base material, no plating and single panel, and the long side size ≤ 21 inch) | 0.75% |
| Impedance Tolerance | ±5ohm(<50ohm), ±10%(≥50ohm) | ±5ohm(<50ohm), ±10%(≥50ohm) |
| Laser Blind Via Size with Filling Plating | 4-5mil (priority 4mil) | 4-5mil (priority 4mil) |
| Max Aspect Ratio for Laser Via Filling Plating | 1:1 (Depth includes copper thickness) | 1:1 (Depth includes copper thickness) |
Thank you for reviewing our PCB capabilities. You can submit your Gerber file and request for a quote here! You can also reach out directly to your sales representative.
We look forward to supporting you and all of your PCB needs.